Filp Chip Bonder & Hybrid Placer 상품리스트
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Surface Mounter
Solder-Paste Printer
Dispenser
PCB Inspection System
Filp Chip Bonder & Hybrid Placer
Management Software
i-PULSE Series
Filp Chip Bonder & Hybrid Placer
Product >
Filp Chip Bonder & Hybrid Placer
리스트뷰
갤러리뷰
i-Cube10 (NEW)
Hybrid Placer
YSB55W
13,000UPH (Including processing time)
YSH20
4,500 UPH (0.8 sec/unit)
The top mounting capability in Flipchip bonders